Polyetheretherketone (PEEK) Film
The product description
Our company's PEEK (polyether ether ketone) film is made from PEEK (polyether ether ketone) raw materials through high temperature heating, extrusion and casting. Poly-ether-ether-ketone (PEEK) is a polymer composed of one ketone bond and two ether repeating bonds in the main chain structure, is a semi-crystalline special polymer material. The benzene ring on the molecular chain can provide the heat resistance and rigidity of the material, while the ether bond and ketone bond can provide the flexibility of the material.
The PEEK (polyether ether ketone) film produced by our company is mainly divided into two categories: Semi-Crystalline PEEK film and amorphous PEEK film. The surface of the film can be divided into three different effects: polished/polished , polished/matte and matte/matte, to meet the application requirements of different customers on different products.
Amorphous PEEK Film Product Technical Data Sheet
|
PHYSICAL |
Density |
ASTM D792 |
g/cm3 |
1.26 |
|
24H Average Water Absorption Equilibnum,24h |
ASTM D570 |
％ |
0.04 |
|
|
Heat Shrinkage |
ISO 11501 ( 200 ℃ ） |
％ |
4.7 |
|
|
MECHANICAL |
Tensile Strength |
ASTM D882 |
MD (MPa) |
110 |
|
ASTM D882 |
TD (MPa) |
109 |
||
|
Elongation Ultimate |
ASTM D882 |
MD(%) |
225 |
|
|
ASTM D882 |
TD(%) |
231 |
||
|
Tensile modulus |
ASTM D882 |
MD (MPa) |
3061 |
|
|
ASTM D882 |
TD (MPa) |
2974 |
||
|
THERMAL |
Melting point |
ISO 11357 |
℃ |
341 |
|
Coefficient of thermal expansion |
ISO 11359(<Tg) |
ppm/K |
40 |
|
|
Glass transition temperature |
ISO 11357 |
℃ |
153 |
|
|
Heat d1stort1on temperature 0.45MPa |
ASTM 0648(0.45MPa) |
℃ |
205 |
|
|
ELECTRICAL |
Dielectric Strength(25µm) |
ASTM D149 |
KV/mm |
120 |
|
Volume Res1st1v1ty @25℃ ，50%RH |
ASTM D257 |
Ω·cm |
1016 |
|
|
Dielectric Constant |
ASTM D150(50MHz) |
|
3.12 |
|
|
Loss Tangent |
ASTM D150(50MHz) |
|
0.004 |
|
Semi-crystalline PEEK Film Product Technical Data Sheet
|
PHYSICAL |
Density |
ASTM D792 |
g/cm3 |
1.29 |
|
24H Average Water Absorption Equilibnum,24h |
ASTM D570 |
％ |
0.04 |
|
|
Heat Shrinkage |
ISO 11501 ( 200℃ ） |
％ |
0.3 |
|
|
MECHANICAL |
Tensile Strength |
ASTM 0882 |
MD (MPa) |
109 |
|
ASTM D882 |
TD (MPa) |
113 |
||
|
Elongation Ultimate |
ASTM D882 |
MD(%) |
252 |
|
|
ASTM D882 |
TD(%) |
287 |
||
|
Tensile modulus |
ASTM D882 |
MD (MPa) |
3961 |
|
|
ASTM D882 |
TD (MPa) |
3919 |
||
|
THERMAL |
Melting point |
ISO 11357 |
℃ |
340 |
|
Coefficient of thermal expansion |
ISO 11359(<Tg) |
ppm/K |
40 |
|
|
Glass transition temperature |
ISO 11357 |
℃ |
154 |
|
|
Heat d1stort1on temperature 0.45MPa |
ASTM D648(0.45MPa) |
℃ |
205 |
|
|
ELECTRICAL |
Dielectric Strength(25µm) |
ASTM D149 |
KV/mm |
120 |
|
Volume Res1st1v1ty @25℃ ，50%RH |
ASTM D257 |
Ω·cm |
1016 |
|
|
Dielectric Con | ||||